Moisture Performance Enhanced Solder Paste "EVASOL 1001 Series"
Achieving wet strengthening while maintaining stability! Capable of supporting various implementations.
Enhanced Wetting Performance The 'EVASOL 1001 Series' strengthens the heat resistance of the flux. It prevents wetting defects due to temperature gaps in mixed assembly of large and small components, as well as incomplete melting in fine patterns. High Storage and Printing Stability This technology controls the reactions within the paste at room temperature, preventing degradation during transport and prolonged printing. Good Wetting with Low Silver With improved heat resistance of the flux, good wetting is achieved even with low silver content. This reduces the impact of metal price fluctuations and enables cost reduction. 【Features】 ■ Good wetting performance under a wide range of conditions ■ High continuous printing stability ■ Excellent transport compatibility *For more details, please refer to the PDF document or feel free to contact us.
- Company：石川金属
- Price：Other
